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<article xsi:noNamespaceSchemaLocation="http://jats.nlm.nih.gov/publishing/1.1/xsd/JATS-journalpublishing1-mathml3.xsd" dtd-version="1.1" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"><front><journal-meta><journal-id journal-id-type="publisher-id">erd</journal-id><journal-title-group><journal-title>Education Reform and Development</journal-title></journal-title-group><issn>2652-5364</issn><eissn>2652-5372</eissn><publisher><publisher-name>Bio-Byword Scientific Publishing Pty. Ltd.</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.26689/erd.v6i3.6621</article-id><article-categories><subj-group subj-group-type="heading"><subject>Article</subject></subj-group></article-categories><title>Failure Analysis and Technical Development of Electronic Components</title><url>https://artdesignp.com/journal/erd/6/3/10.26689/erd.v6i3.6621</url><author>DanXiuku</author><pub-date pub-type="publication-year"><year>2024</year></pub-date><volume>6</volume><issue>3</issue><history><date date-type="pub"><published-time>2024-03-29</published-time></date></history><abstract>The failure analysis involves researching a product to identify its failure mechanism and components. This allows for targeted improvements to prevent subsequent issues and enhance the product’s stability. In the context of electronic component failure analysis, testing and analysis are employed to elucidate the failure process and identify the underlying causes, ensuring the smooth operation of components. This paper introduces some simple and cost-effective analysis methods. During the electronic component failure analysis, sensory examination and internal analysis can aid in judgment. Leveraging extensive analysis experience and utilizing relevant facilities correctly can lead to cost reduction and an increased success rate.</abstract><keywords/></article-meta></front><body/><back><ref-list><ref id="B1" content-type="article"><label>1</label><element-citation publication-type="journal"><p>Liu S, 2021, Discussion on Failure Mechanism of Electronic Components. Electric Power Equipment Management, 2021(7): 205–206.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B2" content-type="article"><label>2</label><element-citation publication-type="journal"><p>Rong Z, Huang Y, 2023, Research on Common Failure Mechanism of MOSFET in Battery Protection Circuit. Electronic Products Reliability and Environmental Testing, 41(2): 21–27.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B3" content-type="article"><label>3</label><element-citation publication-type="journal"><p>Liu Y, Tan A, Deng L, et al., 2023, Failure Analysis and Reliability Improvement of Electromagnetic Relays. Proceedings of 2022 China Household Electrical Appliances Technology Conference, 2023: 6.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B4" content-type="article"><label>4</label><element-citation publication-type="journal"><p>Yang L, 2018, Failure Mode Impact Analysis Technology of Electronic Components. Computer Fans, 2018(29): 92.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B5" content-type="article"><label>5</label><element-citation publication-type="journal"><p>Gao R, Pei X, Xi S, et al., 2023, Failure Analysis of Metal-Aluminum Bonding of Electronic Components. Reliability and Environmental Testing of Electronic Products, 41(6): 74–78.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B6" content-type="article"><label>6</label><element-citation publication-type="journal"><p>Fan P, 2022, Electronic Components Failure Analysis and Technology Analysis. Modern Industrial Economy and Information Technology, 12(12): 240–242.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B7" content-type="article"><label>7</label><element-citation publication-type="journal"><p>Deng Y, Chen R, 2022, Application of Component Failure Analysis in Nuclear Grade Products. Process Automation Instrumentation, 43(11): 91–94.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B8" content-type="article"><label>8</label><element-citation publication-type="journal"><p>Zhou W, 2022, Fault Failure and Cause Analysis of Electronic Component Conductors. Environmental Technology, 40(3): 27–32.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B9" content-type="article"><label>9</label><element-citation publication-type="journal"><p>Zhang Y, Cheng Z, Lian G, et al., 2023, Fault Mode Analysis of Electronic Equipment Based on PoF Model and FTA. Modern Defense Technology, 51(4): 86–96.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B10" content-type="article"><label>10</label><element-citation publication-type="journal"><p>Chen J, 2022, Automotive Electronic Components Failure Mechanism and Simulation Analysis. Journal of Cars and New Energy, 5(5): 77–79.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B11" content-type="article"><label>11</label><element-citation publication-type="journal"><p>Feng L, Hua Z, 2022, Arrival Screening and Quality Control of Electronic Components. Proceedings of 2022 Annual Meeting of Tianjin Electronics Industry Association, 2022: 3.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B12" content-type="article"><label>12</label><element-citation publication-type="journal"><p>Luo D, Ni Y, Liang H, et al., 2021, The Past, Present and Future of Failure Analysis of Electronic Components. Electronic Product Reliability and Environmental Test, 39(S2): 8–15.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B13" content-type="article"><label>13</label><element-citation publication-type="journal"><p>Li D, 2018, Exploration of the Electronic Components Failure Analysis. Digital Communication World, 2018(11): 245.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B14" content-type="article"><label>14</label><element-citation publication-type="journal"><p>Guan W, 2018, Failure Cause Analysis and Solution of Electronic Components. Electric Power System Equipment, 2018(1): 157–158.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B15" content-type="article"><label>15</label><element-citation publication-type="journal"><p>Zhang G, 2021, Analysis Method of Failed Electronic Components. Digital Communications World, 2021(1): 120–121 + 94.</p><pub-id pub-id-type="doi"/></element-citation></ref></ref-list></back></article>
