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<article xsi:noNamespaceSchemaLocation="http://jats.nlm.nih.gov/publishing/1.1/xsd/JATS-journalpublishing1-mathml3.xsd" dtd-version="1.1" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"><front><journal-meta><journal-id journal-id-type="publisher-id">JERA</journal-id><journal-title-group><journal-title>Journal of Electronic Research and Application</journal-title></journal-title-group><issn>2208-3502</issn><eissn>2208-3510</eissn><publisher><publisher-name>Bio-Byword Scientific Publishing Pty. Ltd.</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.26689/jera.v10i5.15273</article-id><article-categories><subj-group subj-group-type="heading"><subject>Article</subject></subj-group></article-categories><title>A Study on the Influence of Stress State at the End of Dynamic Gate Biasing and Voltage Pre-Treatment on Threshold Voltage Shift in Silicon Carbide</title><url>https://artdesignp.com/journal/JERA/10/5/10.26689/jera.v10i5.15273</url><author>LiRuguan,LiBoran,WuXiaohui,XiaoYu</author><pub-date pub-type="publication-year"><year>2026</year></pub-date><volume>10</volume><issue>5</issue><history><date date-type="pub"><published-time>2026-06-29</published-time></date></history><abstract>This study focuses on the stress state of silicon carbide (SiC) power devices after the end of dynamic gate bias stress (DGS), and the influence mechanism of different pretreatments on the device threshold voltage (Vth) shift. Through a combination of experimental design and theoretical analysis, the impact of the instantaneous electric field distribution and charge trapping/release behavior at the end of dynamic gate bias on subsequent Vth stability was systematically explored. Research results show that the stress state (positive voltage/negative voltage) at the end of dynamic gate bias and whether pretreatment is performed will significantly affect the Vth shift of SiC devices under dynamic operating conditions. This research provides important theoretical basis and experimental guidance for the stability design and reliability improvement of SiC power devices.</abstract><keywords/></article-meta></front><body/><back><ref-list><ref id="B1" content-type="article"><label>1</label><element-citation publication-type="journal"><p>Jiang F, 2017, Study on the Characteristics of Silicon Carbide MOSFETs, thesis, Zhejiang University.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B2" content-type="article"><label>2</label><element-citation publication-type="journal"><p>Yan M, Zhang Q, 2021, Study on the Parameter System and Testing Methods of SiC MOSFETs. Information Technology and Standardisation, 2021(9): 25–29.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B3" content-type="article"><label>3</label><element-citation publication-type="journal"><p>JEDEC Solid State Technology Association, 2023, Guidelines for Measuring the Threshold Voltage (VT) of SiC MOSFETs: JEP183A, JEDEC Publication, 21–6</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B4" content-type="article"><label>4</label><element-citation publication-type="journal"><p>Wang Z, Ren T, 2023, A Study on the Measurement Method of Threshold Voltage for SiC MOSFETs Considering the Relaxation Effect. Electronic Devices, 1(46): 74–78.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B5" content-type="article"><label>5</label><element-citation publication-type="journal"><p>Deng X, 2019, A Study on the Electrical Characteristics of SiC MOSFET Power Transistors, thesis, University of Electronic Science and Technology of China.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B6" content-type="article"><label>6</label><element-citation publication-type="journal"><p>Chen C, Wang Z, Zhang R, et al., 2024, Preconditioning for Accurate Threshold Voltage Extraction of SiC MOSFETs after AC Bias Temperature Instability in Reliability Test, 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 4426–4430.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B7" content-type="article"><label>7</label><element-citation publication-type="journal"><p>Third Generation Semiconductor Industry Technology Innovation Strategic Alliance, 2023, Blue Book on the Third Generation Semiconductor Power Device Industry and Standardisation.</p><pub-id pub-id-type="doi"/></element-citation></ref></ref-list></back></article>
