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<article xsi:noNamespaceSchemaLocation="http://jats.nlm.nih.gov/publishing/1.1/xsd/JATS-journalpublishing1-mathml3.xsd" dtd-version="1.1" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance"><front><journal-meta><journal-id journal-id-type="publisher-id">JERA</journal-id><journal-title-group><journal-title>Journal of Electronic Research and Application</journal-title></journal-title-group><issn>2208-3502</issn><eissn>2208-3510</eissn><publisher><publisher-name>Bio-Byword Scientific Publishing Pty. Ltd.</publisher-name></publisher></journal-meta><article-meta><article-id pub-id-type="doi">10.26689/jera.v8i4.7935</article-id><article-categories><subj-group subj-group-type="heading"><subject>Article</subject></subj-group></article-categories><title>Furnace Temperature Curve Optimization Model Based on Differential Evolution Algorithm</title><url>https://artdesignp.com/journal/JERA/8/4/10.26689/jera.v8i4.7935</url><author>ChengYiming</author><pub-date pub-type="publication-year"><year>2024</year></pub-date><volume>8</volume><issue>4</issue><history><date date-type="pub"><published-time>2024-08-13</published-time></date></history><abstract>When soldering electronic components onto circuit boards, the temperature curves of the reflow ovens across different zones and the conveyor belt speed significantly influence the product quality. This study focuses on optimizing the furnace temperature curve under varying settings of reflow oven zone temperatures and conveyor belt speeds. To address this, the research sequentially develops a heat transfer model for reflow soldering, an optimization model for reflow furnace conditions using the differential evolution algorithm, and an evaluation and decision model combining the differential evolution algorithm with the Technique for Order Preference by Similarity to Ideal Solution (TOPSIS) method. This approach aims to determine the optimal furnace temperature curve, zone temperatures of the reflow oven, and the conveyor belt speed.</abstract><keywords/></article-meta></front><body/><back><ref-list><ref id="B1" content-type="article"><label>1</label><element-citation publication-type="journal"><p>Yang SM, Tao WQ, 2006, Heat Transfer. Higher Education Press Publication, Beijing.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B2" content-type="article"><label>2</label><element-citation publication-type="journal"><p>Yao H, 2018, Modeling and Simulation of Plate Level Reflow Soldering Based on Ansys Icepak, thesis, Beihua Institute of Aerospace Technology.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B3" content-type="article"><label>3</label><element-citation publication-type="journal"><p>Hou Y, 2014, Numerical Simulation and Experimental Research on Creep Shaping Process of 2A14 Aluminum Alloy, thesis, Harbin Institute of Technology.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B4" content-type="article"><label>4</label><element-citation publication-type="journal"><p>Hong J, Xu Z, 2018, Simulation Study of Reflow Soldering Process Based on Finite Element Theory. 2018 China High-end SMT Academic Conference, 2018: 181–186.</p><pub-id pub-id-type="doi"/></element-citation></ref><ref id="B5" content-type="article"><label>5</label><element-citation publication-type="journal"><p>He C, Feng X, 2001, Principles of Chemical Engineering. Science Press, Beijing.</p><pub-id pub-id-type="doi"/></element-citation></ref></ref-list></back></article>
