SSRScientific and Social Research2661-43322981-9946Bio-Byword Scientific Publishing Pty. Ltd.10.26689/ssr.v8i7.15763ArticleFiller Selection and Fabrication Methods for Highly Thermally Conductive Polymer Composites: A Reviewhttps://artdesignp.com/journal/SSR/8/7/10.26689/ssr.v8i7.15763HuangGuangxing2026872026-08-14In high-power electronic devices, the thermal conductivity of polymer composites is governed not simply by the intrinsically high thermal conductivity of the fillers, but by their ability to form continuous heat conduction pathways with few structural defects within the polymer matrix. This review examines the selection of carbon-based, ceramic, and metallic fillers, and discusses how hybrid filler systems, filler loading, and surface modification influence filler dispersion, interparticle distance, interfacial contact, and network formation. Vacuum-assisted filtration, template-assisted methods, electrospinning, field-assisted alignment, and three-dimensional printing are further considered in terms of their effects on filler arrangement and connectivity. Filler size, morphology, surface chemistry, and field responsiveness guide fabrication method selection. Fabrication then determines thermal network continuity. Future research needs to develop efficient thermal pathways at reduced filler content and porosity using stable, scalable processes.

Guo Y, Ruan K, Gu J, 2021, Controllable Thermal Conductivity in Composites by Constructing Thermal Conduction Networks. Materials Today Physics, 2021(20): 100449.

Guo Y, Ruan K, Shi X, et al., 2020, Factors Affecting Thermal Conductivities of the Polymers and Polymer Composites: A Review. Composites Science and Technology, 2020(193): 108134.

Zhang L, Deng H, Fu Q, 2018, Recent Progress on Thermal Conductive and Electrical Insulating Polymer Composites. Composites Communications, 2018(8): 74–82.

Jang JU, Nam HE, So SO, et al., 2022, Thermal Percolation Behavior in Thermal Conductivity of Polymer Nanocomposite with Lateral Size of Graphene Nanoplatelet. Polymers, 14(2): 323.

Yuan K, Shi J, Aftab W, et al., 2020, Engineering the Thermal Conductivity of Functional Phase—Change Materials for Heat Energy Conversion, Storage, and Utilization. Advanced Functional Materials, 30(8): 1904228.

Zhou Y, Wu S, Long Y, et al., 2020, Recent Advances in Thermal Interface Materials. ES Materials & Manufacturing, 7(7): 4–24.

Lee YJ, Park JY, Cho HB, et al., 2026, Interfacial Anchoring via Thin–OH Functional Enables Hydration-resistant, Enhanced Thermal Conductivity MgO Composites. Applied Surface Science, 2026(738): 166922.

Spinelli G, Guarini R, Guadagno L, et al., 2025, Experimental, Simulation and Theoretical Insights into Anisotropic Thermal Behavior of Epoxy Nanocomposites Reinforced with Carbonaceous Nanofillers. Polymers, 17(9): 1248.

Xu Z, Zhang C, Li Y, et al., 2023, Effect of the Alumina Micro-particle Sizes on the Thermal Conductivity and Dynamic Mechanical Property of Epoxy Resin. Plos One, 18(10): e0292878.

Fang H, Li G, Wang K, et al., 2023, Significant Improvement of Thermal Conductivity of Polyamide 6/Boron Nitride Composites by Adding a Small Amount of Stearic Acid. Polymers, 15(8): 1887.

Rösel U, Drummer D, 2025, Improving the Thermal Conductivity by Varying the Filler Geometry of Copper in Thermosets. Polymers, 18(1): 75.

Alhamidi A, Anis A, Bashir Z, et al., 2023, Studies on the Effect of the Addition of Nano-spherical Particles of Aluminum on the Thermal, Mechanical, and Morphological Properties of PBT–PET Blend Composites. Polymers, 15(17): 3625.

Cheng HL, Chu N, Jin FL, et al., 2024, Role of Copper Nanoparticles in the Thermal and Mechanical Properties of Expanded Graphite-reinforced Epoxy Hybrids. ACS Omega, 9(15): 17533–17540.

Wang J, Zhang S, Yan C, et al., 2025, Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity. Materials, 18(21): 5011.

Choi J, Song K, Kim JI, et al., 2022, Enhanced Thermal and Electrical Properties of Hybrid Polymer Composites Containing Al2O3 Microspheres and Nanowires. Ceramics International, 48(21): 32081–32088.

Tang B, Cao M, Yang Y, et al., 2023, Synthesis of KH550-modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites. Polymer, 15(6): 1415.

Yuan F, Guan Q, Dou X, et al., 2024, High-yield Synthesis of Hydroxylated Boron Nitride Nanosheets and their Utilization in Thermally Conductive Polymeric Nanocomposites. RSC Advances, 14(30): 21230–21240.

He M, Zhang L, Ruan K, et al., 2025, Functionalized Aluminum Nitride for Improving Hydrolysis Resistances of Highly Thermally Conductive Polysiloxane Composites. Nano-Micro Letters, 17(1): 134.

Dong D, Gu X, Lu S, et al., 2023, Flexible Layered Reduced Graphene Oxide/aramid Nanofiber Composite Membrane with High Thermal Conductivity and Mechanical Properties. Materials Research Express, 10(7): 076401.

Wang B, Wan S, Niu M, et al., 2023, Oriented Three-dimensional Skeletons Assembled by Si3N4 nanowires/AlN Particles as Fillers for improving Thermal Conductivity of Epoxy Composites. Polymers, 15(22): 4429.

Han L, Sun H, Li W, et al., 2025, Constructing Binder-free 3D Thermal Networks with Hexagonal Boron Nitride of Varying Sizes to Enhance Polydimethylsiloxane Composites: A Comparative Study. RSC Advances, 15(22): 17388–17396.

Zhang Y, Wang S, Wu H, et al., 2024, Constructing Heterostructured MWCNT-BN Hybrid Fillers in Electrospun TPU Films to Achieve Superior Thermal Conductivity and Electrical Insulation Properties. Polymers, 16(15): 2139.

Jia H, He R, Tian D, et al., 2025, Magnetic-Field-Induced Three-Dimensional Networks to Enhance the Thermal Conductivity for Polydimethylsiloxane-Based Thermal Interface Materials. Polymer Composites, 46(18): 17418–17429.

Xu K, Zhou Y, Yang R, et al., 2025, Magnetic Alignment of Carbon Nanotubes in Polymers for Enhanced Thermal Conductivity. Nanoscale, 17(48): 28185–28194.

Xiao B, Zheng X, Zhao Y, et al., 2023, Controlling Shear Rate for Designable Thermal Conductivity in Direct Ink Printing of Polydimethylsiloxane/Boron Nitride Composites. Polymers, 15(16): 3489.